Toshiba announces the industry’s largest capacity 128GB solid state devices line up. Its form factor is 3mm thick, 1.8 inches and 2.5 inches module finished goods. Each has the densities of 32GB, 64GB, 128GB and SATA2 interface transfer rate of 3Gbps.

The larger capacity per chip new products, MLC(Multilevel cell) utilizes NAND flash memory fabricated with 56nm process technology as compared to traditional SSD single level cell and has a MTBF( Mean time between failure) of one million hours.

The module is scheduled for sample shipment next February and mass production from March.